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Semiconductors are materials which may have monumental influence on human life. In every device that people use, semiconductors exist everywhere – in microprocessor ships or transistors or any essential device which we used in our everyday activity. In 3kv Wafers manufacturing industry there are various big players. It has become a multi-billion dollar industry today. In our day-to-day life we use great deal of such appliances or products who have semiconductors for their main component – from microwave to microprocessor chips to transistors to computers. In computers which can be life to the majority people have these semiconductors at their heart. Most in the semiconductors are designed from silicon, this is why silicon is soul from a digital camera. Amongst all semiconductor manufacturing devices, diode could be the simplest one. It is a principal component of all semiconductors that are employed in the fabless engineering industry or any other industry. The most commonly designed components like ASIC designs, integrated circuits and microprocessor production, everywhere silicon is the major ingredient. Another important component is germanium which can be specifically used in transistors and various other electronics. It is employed in various industries including fiber optics and infrared optics. It is also employed in polarization catalysts, solar cell applications etc. Another very popular semiconductor is Gallium arsenide. It is often a III/ V semiconductor which is extensively utilized in the manufacturing of devices like microwave frequency integrated circuits, infrared light-emitting diodes, monolithic microwave integrated circuits, solar panels, laser diodes, as well as in the creation of optical windows. While developing the silicon semiconductor devices, fabrication is really a major process. It involves various important steps. Crystal preparation is the initial step which initiates the procedure. In this process a single crystal of silicon is grown into a good cylindrical shape. Then wafer preparation is conducted where solid cylinder of silicon is cut using a diamond saw blade uniformly. Then thin film generation is done where physical or electrical isolation between two adjacent layers is supplied or wafer is prepared for doping and lithography stages. Here Lithography is a process where patterns on materials are engraved. Then a major step is carried out where high precision flat metal parts are produced, that is also generally known as chemical milling. Furthermore, doping is carried out where we add impurities into a very pure semiconductor. This process aims to modulate the electrical properties of a semiconductor. Finally, metallization is performed where material is treated and combined with a metal. This completes the method.